ʻO ka USB Explorer USB 3.0 a me ka ʻōnaehana hoʻāʻo 2.0
Nāʻike huahana
| Papa, | 14 mau papa |
| Ka mānoanoa o ka papa | 1.60 MM |
| Mea Pono | PPO / PPE + FR4 kiʻekiʻe TG 175 ℃ |
| Ka mānoanoa keleawe | 1 OZ (35um) |
| ʻIli Pau | Gula Kaiapuni; Au Mānoanoa 0.05 um; Ni mānoanoa 3um |
| Min Hole (mm) | 0.20mm ma o ka plug me ka pale maka paʻa |
| ʻO ka laulā laina laina (mm) | 0.13mm |
| Mokuna laina min (mm) | 0.12mm |
| Makakiʻi paukū | ʻŌmaʻomaʻo + ʻeleʻele |
| Waihona Legend | keʻokeʻo |
| Ka nui o ka papa | 220 * 140mm |
| Hale Pule PCB | Hoʻohui ʻili kuʻina & ma o ka hui ʻana o ka lua |
| Ua hoʻokō ʻo RoHS | Ke kaʻina hui manuahi alakaʻi |
| Ka nui o nā min | 0201 |
| Huina ʻāpana | 1282 no ka papa |
| Pūʻulu IC | BGA; QFN |
| IC nui | Fairchild, Ma Semiconductors, Maxim, ADI, Microchip, TI,, Cypress Semi, NXP a pēlā aku. |
| Hōʻike | AOI, X-Ray, Hōʻoia hana |
| Palapala noi | Hōʻoia & ana |
Hoʻomaopopo kā mākou ʻenehana hoʻokolohua iā mākou i hoa pilikino no ka ʻoihana hana & ana a ke hāʻawi nei mākou i nā hopena no nā ʻoihana alakaʻi i ka honua
> Nā mika Humidity
> Nā mea hoʻopaʻa moʻolelo a me nā mea hoʻopaʻa ʻikepili
> Nānā Spectrum a me ka hōʻailona
> Ka Ikepili Ke Kinoea
> Nā mika kūmole
> Nā lakohana hoʻāʻo hōʻino ʻole (NDT)
> Nā mīkini ʻike pono
> Nā lako hoʻāʻo wai a me nā hana kaiapuni
> Ka hoʻoponopono kānana
> Nā pono hoʻāʻo uila
> Nā mea hoʻopaʻa ʻikepili kalepa
> ʻImi ʻike hao
> A me nā mea hou aku
ka mana o ka mana otal a hoʻemi i nā hoʻomanawanui he mea nui ia no nā ʻenehana kahi e ana ai ka hana huahana mua.
Hiki ke hoʻolako ʻia nā papa kaapuni āpau i hana ʻia e pandawill Circuits i nā kūlana IPC Class 2 a i ʻole 3, akā ʻo ka mea nui aʻe, hoʻopili ka pandawill i nā kaohi hoʻomanawanui ʻoi loa e hōʻoia i ka hāʻawi ʻana o nā huahana āpau i ka hoʻomau o nā nui o ke kino a me ka hana uila.
Hiki i nā kikoʻī IPC i kekahi manawa ke hoʻokaʻawale a kala hoʻi no ka hana ʻana i nā papa kaapuni, akā ʻo ka ʻokoʻa ma waena o ka hoʻomanawanui o luna a me lalo hiki i ka ʻāpana o 20% variance. manaʻo ʻo pandawill ʻaʻole lawa kēia kaohi a pale loa ʻia inā mālama ʻia ke koho pono ʻana i ke koho ʻana i nā mea maka a me ka hana ʻana i nā PCB multi-layer.
No kēlā me kēia papa kaapuni i hāʻawi ʻia e ka pandawill Circuit, hoʻolako mākou i kahi ʻaoʻao e hōʻike ana i ka hōʻike e like me ke ʻano e hōʻike ana i nā nui o ke kino, nā mea, nā hohonu plating a me nā hōʻoia ʻana o ka hana.
Hāʻawi pū ʻia nā papa me kahi ʻāpana keʻa inā koi ʻia e hōʻike i ka hana ʻana o ka papa a me ka hana plating kūloko, a me kahi laʻana solderability i hōʻike i ka hana pulu ʻana o ka hoʻopau solderable a me ke kūpaʻa o PCB i ka delamination.
E mālama ʻia kēlā me kēia pūʻulu mua i ka lua o ka nānā ʻana ma ke keʻena ʻo pandawill Circuits a ua hōʻailona ʻia kēlā me kēia pack me kā mākou lōkō i ʻae ʻia
