RF PCB pālolo pālolo + FR4 substrate
Nāʻike huahana
Papa, | 6 mau papa |
Ka mānoanoa o ka papa | 1.6MM |
Mea Pono | IT-180A Tg170 + pālolo (280) |
Ka mānoanoa keleawe | 1 OZ (35um) |
ʻIli Pau | (ENIG) Gula immersion |
Min Hole (mm) | Pākuʻi ʻia ʻo 0.203 me ka pale maka paʻa |
ʻO ka laulā laina laina (mm) | 0.10mm (4 mil) |
Mokuna laina min (mm) | 0.13mm (5 mil) |
Makakiʻi paukū | Ōmaʻomaʻo |
Waihona Legend | keʻokeʻo |
Impedance | Single Impedance & ʻokoʻa Impedance |
Hoʻopili | ʻEke anti kūpaʻa |
Hōʻikeʻike E. | ʻO ka ʻimi lele a i ʻole ke kau pono ʻana |
Hae ʻae ʻia | IPC-A-600H Papa 2 |
Palapala noi | Telecom |
RF PCB
I mea e hoʻokō ai i nā koi e hoʻonui ʻia nei no nā Pīpī Pīnīnī & RF Paipalapala Paʻi no kā mākou mea kūʻai aku a puni ka honua, ua hoʻonui mākou i kā mākou hoʻopukapuka i nā makahiki i hala iho nei i lilo mākou i mea hana papa honua o PCB me ka hoʻohana ʻana i nā lamineka kiʻekiʻe.
Pono kēia mau noi i nā lamineka me nā uila uila, hoʻomehana, mechanical, a i ʻole nā ʻano hana i ʻoi aku i mua o nā mea maʻamau FR-4 maʻamau. Me ko mākou mau makahiki he nui o ka ʻike me ka PTFE-based microwave laminate, maopopo iā mākou ka hilinaʻi kiʻekiʻe a me nā koi ahonui paʻa o ka hapa nui o nā noi.
Mea PCB No RF PCB
E hana i nā hiʻohiʻona ʻokoʻa āpau o kēlā me kēia noi PC PCB, ua hoʻomohala mākou i nā launa pū me nā mea lako e like me Rogers, Arlon, Nelco, a me Taconic e inoa wale ai i kekahi. ʻOiai he loea loa ka hapa nui o nā mea hana, paʻa mākou i nā huahana nui o kā mākou hale kūʻai mai Rogers (4003 & 4350 series) a me Arlon. ʻAʻole mākaukau ka nui o nā ʻoihana e hana i kēlā me ke kumukūʻai nui o ka lawe ʻana i ka papa helu i hiki ke pane koke.
Hiki ke paʻakikī ke hoʻolālā i nā papa kaapuni ʻenehana kiʻekiʻe me nā lamineka alapine kiʻekiʻe no ka noʻonoʻo ʻana i nā hōʻailona a me nā pilikia me ka mālama ʻana i ka hoʻololi wela wela i kāu noi. ʻO nā mea pono kiʻekiʻe kiʻekiʻe PCB i loaʻa i ka conductivity thermal haʻahaʻa me ka FR-4 maʻamau i hoʻohana ʻia i nā PCB maʻamau.
Hoʻomaʻamaʻa loa nā hōʻailona RF a me nā lewa uila i ka walaʻau a ʻoi aku ka nui o nā hoʻomanawanui impedance ma mua o nā papa kaapuni uila. Ma ka hoʻohana ʻana i nā hoʻolālā papa honua a me ka hoʻohana ʻana i kahi radius bend bend i ka impedance control traces hiki ke kōkua i ka hoʻolālā ʻana i ke ʻano kūpono loa.
Ma muli o ka lōʻihi o ke kaapuni ka hilinaʻi pinepine a me ka hilinaʻi o nā mea, hiki i nā mea PCB me nā dielectric mau (Dk) kiʻekiʻe ke hopena i nā PCB liʻiliʻi e like me ka hiki ke hoʻohana i nā hoʻolālā kaapuni miniaturize no nā impedance kikoʻī a me nā pae pinepine. ʻO nā laminate kiʻekiʻe-Dk kiʻekiʻe (Dk o 6 a ʻoi paha) i hui pū ʻia me nā kumu kūʻai FR-4 haʻahaʻa e hana i nā hoʻolālā multilayer hybrid.
ʻO ka hoʻomaopopo ʻana i ka coefficient o ka hoʻonui ʻana o ka thermal (CTE), ka hoʻomau dielectric, coefficient thermal, coefficient o ka dielectric (TCDk), dissipation factor (Df) a me nā mea e like me ka ʻae ʻana, a me ka nalowale o nā mea PCB i loaʻa e kōkua i ka RF PCB. hana ka mea hoʻolālā i kahi hoʻolālā paʻa e ʻoi aku i nā mea i koi ʻia.
Nā kaha ākea ākea
Ma waho aʻe o ka microsb / RF PCB maʻamau, hiki i kā mākou hiki ke hoʻohana i nā laminate PTFE pū kekahi:
Nā Papa Dielectric Huihui a i ʻole Mixed (PTFE / FR-4 hui pū)
ʻO nā PCB i kākoʻo ʻia i ke kila
Nā Papa Lani (Mīkini a me Laser i ʻeli ʻia)
Pākuʻi lihi
Nā hōkū hōkū
Nā PCB Hōʻike Nui
Makapō / kanu a me Laser Via ka
ʻO ke gula gula a me ka papa inoa ENEPIG