ʻŌnaehana hoʻoholo kaʻaahi
Nāʻike huahana
| Papa, | Papa 12 |
| Ka mānoanoa o ka papa | 1.60 MM |
| Mea Pono | Isola 370hr |
| Ka mānoanoa keleawe | 2OZ (70um) |
| ʻIli Pau | HASL alakaʻi manuahi |
| Min Hole (mm) | 0.30mm ma o ka plug me ka pale maka paʻa |
| ʻO ka laulā laina laina (mm) | 0.10mm (4 mil) |
| Mokuna laina min (mm) | 0.10mm (4 mil) |
| Makakiʻi paukū | Ōmaʻomaʻo |
| Waihona Legend | keʻokeʻo |
| Ka nui o ka papa | 148 * 260mm |
| Hale Pule PCB | Hoʻohui ʻili kuʻina & ma o ka hui ʻana o ka lua |
| Ua hoʻokō ʻo RoHS | Ke kaʻina hui manuahi alakaʻi |
| Ka nui o nā min | 0402 |
| Huina ʻāpana | 1095 no ka papa |
| Pūʻulu IC | BGA; QFN |
| BGA | 8 |
| BGA kinipōpō nui | 1489 |
| Mimimum BGA spacing | 0.80 mm o |
| Ka palena iki IC spacing | 0.50 mm o |
| IC nui | Maxim, ON Semiconductor, Micron, Texas Instruments, NXP Semiconductors, Linear, Fairchild Semiconductor, ST, Cypress Semi, Freescale, IDT |
| Hōʻike | AOI, X-Ray, Hōʻoia hana |
| Pākuʻi kūlike | 9-20557-LV Dymax |
| Palapala noi | ʻ controlnaehana hoʻoholo hōʻailona alahao |
ʻO nā noi ʻenehana nā ʻenehana like ʻole i noi ʻia i nā ʻoihana he nui. Mai ka hui kaapuni papa pai ʻia (PCBA) i ka hui huahana piha a me ka hana ʻana, pili ia i ka hana ʻana me nā papa kaapuni uila uila e like me nā pā mechanical (nā metala, CNC, nā plastics), e kiʻi i ka hopena maikaʻi loa no kā mākou mea kūʻai aku. Pono ka mākaukau o kāu hoa EMS no nā makahiki i ka hana ʻana i nā uila.
ʻO ka ʻoihana ʻenehana ka mōʻaukala kekahi o nā ʻāpana nui i lawelawe ʻia e Pandawill akā ke ʻike nei mākou i kēia manawa i ka Pūnaewele o nā Mea, me kahi nānā kikoʻī i ka Pūnaewele ʻOihana o nā Mea (IIoT), kahi e lawe ai i ka pili a me ka automation i nā hale hana a me nā hui a puni ka honua
No ke kākoʻo ʻana i ka holomua, ʻo ka hui pū ʻana me ka hoa pono he mea hana i ka lawe ʻana i nā huahana hou i ka makeke kūleʻa. Ma Pandawill, hāʻawi mākou i ka pūʻulu lawelawe holoʻokoʻa mai ka hoʻolālā a me ka wehewehe kikoʻī i ka hana nui i nā wahi āpau o 18.
Ma ke ʻano he ʻenehana hana ʻenehana uila a me ka mea hana uila uila, alakaʻi i loko o kā mākou kahua, ua hoʻohui mākou i loko o kā mākou hale hana i nā hana hou i lawe ʻia me ka ʻoihana 4.0, e like me: automation, intelligence artific, cloud computing, 3D-Print, Internet of Things platform (IoT ), ʻikepili nui a me nā kālailai.
ʻO ka mea lawelawe hana hana uila no ka ʻoihana, ʻo kā mākou hiki ke:
> Nā mīkini ATM & ʻenehana
> Nā hāmeʻa a me nā pono hana
> Mīkini
> Mīkini hoʻolimalima
> Nā ʻōnaehana uila
> Nā hoʻoili uila
> Nā mea lawe, Transceivers
> Nā pono hana
> Nā hāmeʻa pono hana
