FPC / ʻoʻoleʻa-Flex (hiki)
ʻOʻoleʻa PCB (nā pono)
FPC / ʻoʻoleʻa-Flex (hiki)
| Helu papa | 1-28 papa |  |
| ʻAno lamineka | FR-4 (High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, kumu aluminika, Maʻa keleawe, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Ka mānoanoa o ka papa | 6-240mil | |
| ʻO ke kaupaona keleawe Max Base | 210um (6oz) no ka papa o loko 210um (6oz) no ka papa waho | |
| Ka nui o ka drill mechanical | 0.2mm (0.008 ″) | |
| Lākiō hiʻohiʻona | 12: 1 | |
| Ka nui o ka palena ʻo Max | ʻAoʻao Sigle a ʻelua paha ʻaoʻao: 500mm * 1200mm, | |
| Pākuʻi Multilayer: 508mm X 610mm (20 ″ X 24 ″) | ||
| Min laina laula / hakahaka | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Via ʻano lua | Makapō / kanu / hoʻopili ʻia (VOP, VIP…) | |
| HDI / Microvia | AE | |
| Pau ka ʻili | HASL | |
| Alakaʻi Free HASL | ||
| Gula Kaiapuni (ENIG), Tin Immersion, Silver Immersion | ||
| ʻO Organic Solderability Preservative (OSP) / ENTEK | ||
| ʻO ke gula gula (plating gula paʻa) | ||
| ENEPIG | ||
| Koho Pālākiō gula, mānoanoa gula a i 3um (120u ") | ||
| Gulima Gula, Carbon Print, Peelable S / M | ||
| ʻO ka waihoʻoluʻu mask mask | ʻŌmaʻomaʻo, polū, keʻokeʻo, ʻeleʻele, maopopo, etc. | |
| Impedance | Hoʻomoe kū hoʻokahi, ʻokoʻa, impedance coplanar kaohi ʻia ± 10% | |
| ʻAno hoʻopau palena | Ke Alakaʻi ʻO CNC; Pākuʻi V / ʻoki; Punch | |
| Palekana | ʻO ke ahonui Min Min (NPTH) ± 0.05mm | |
| ʻO ke ahonui ʻo Min Hole (PTH) ± 0.075mm | ||
| ʻO Min tolerance tolerance ± 0.05mm |
ʻOʻoleʻa PCB (nā pono)
| Hoʻokaʻina | 'Ikamu | Hiki |  |
|
| Helu papa | PCB paʻa paʻa | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Papa | Min. Mānoanoa | 0.08 +/- 0.03mm | ||
| Max. Mānoanoa | 6mm | |||
| Max. Nui | 485mm * 1000mm | |||
| Hole & Pili | Min.Hole | 0.15mm | ||
| ʻO Min.Slot Hole | 0.6mm | |||
| Lākiō hiʻohiʻona | 10: 1 | |||
| Huli | Min. Ākea / hakahaka | 0.05 / 0.05mm | ||
| Ke ahonui | Kumumea W / S. | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Hole i ka lua | ± 0.075mm | |||
| Ana Hole | ± 0.075mm | |||
| Impedance | 0 ≤ Waiwai ≤ 50 ±: ± 5Ω 50Ω ≤ Waiwai: ± 10% Ω | |||
| Mea Pono | Hoakaka Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Mea hoʻolako kumu | ʻO Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Hōʻike Coverlay | PI: 2mil 1mil 0.5mil | |||
| Waihona LPI | ʻŌmaʻomaʻo / melemele / keʻokeʻo / ʻeleʻele / polū / ʻulaʻula | |||
| ʻO PI Stiffener | T: 25um ～ 250um | |||
| FR4 Stiffener | T: 100um ～ 2000um | |||
| ʻO SUS Stiffener | T: 100um ～ 400um | |||
| ʻO AL Stiffener | T: 100um ～ 1600um | |||
| Lola | 3M / Tesa / Nitto | |||
| Pale kaua EMI | Ke kiʻi ʻoniʻoni kālā / Keleawe / ʻĀpana kala | |||
| Pau ka ʻili | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed manuahi) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Pākuʻi gula paʻa | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Gula kukuna | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Kālā Immesion | Ag: 0.1 - 0.3um | |||
| Tin Pāpaʻi | Sn: 5um - 35um | |||