1. Hoʻolauna

Kū ʻo HDI no High Density Interconnector. ʻO kahi papa kaapuni i ʻoi aku ka kiʻekiʻe o ka uea o kēlā me kēia ʻāpana i kūʻē i ka papa maʻamau i kapa ʻia ʻo HDI PCB. Loaʻa i nā HDB PCB nā wahi i ʻoi aku ka maikaʻi a me nā laina, nā vias liʻiliʻi a me nā pads hopu a me ke kiʻekiʻe o ka pad pili. He mea kōkua ia i ka hoʻomaikaʻi ʻana i ka hana uila a me ka hoʻēmi ʻana i ka paona a me ka nui o nā lakohana. ʻO HDI PCB ke koho ʻoi aku ka maikaʻi no ka helu papa kiʻekiʻe a me nā papa lamineka kumukūʻai.

Nā Pōmaikaʻi HDI Key

E like me ka koi ʻana o ka mea kūʻai aku e loli, pono nō hoʻi ka ʻenehana. Ma ka hoʻohana ʻana i ka ʻenehana HDI, loaʻa i nā mea hoʻolālā ke koho e kau i nā mea hou aʻe ma nā ʻaoʻao ʻelua o ka PCB maka. ʻO nā mea he nui ma o nā kaʻina hana, e like me ma ka pale a me nā makapō ma o ka ʻenehana, e ʻae i nā mea hoʻolālā i kahi waiwai PCB e hoʻonoho i nā ʻāpana i ʻoi aku ka liʻiliʻi ma kahi kokoke. ʻO ka nui o ka nui a me ka pitch e ʻae ai no ka nui o I / O i nā geometry liʻiliʻi. ʻO kēia ka wikiwiki o ka lawe ʻana i nā hōʻailona a me ka hōʻemi nui ʻana i ka nalo ʻana o nā hōʻailona a me nā lohi o ka hele ʻana.

Nā ʻenehana ma HDI PCB

• Makapō Via: Ke hoʻopili nei i kahi papa waho e hoʻopau ana i kahi papa o loko
• Kanu ʻia ma o: ma o ka lua o nā papa nui
• Microvia: ʻO Blind Via (coll. Ma o) me ke anawaena ≤ 0.15mm
• SBU (Sequential Build-Up): Sequential layer buildup me ka liʻiliʻi ʻelua mau kaomi hana ma multilayer PCBs
• SSBU (Semi Sequential Build-Up): Kaomi ʻana i nā substructure i hōʻike ʻia ma ka ʻenehana SBU

Via ma Pad

Hoʻokomo ka ʻuhane mai nā ʻenehana mauna kiʻekiʻe mai ka hopena o 1980's i kaomi ʻana i nā palena me BGA, COB a me CSP i nā ʻīniha kuea ʻāpana liʻiliʻi. ʻO ka ma o ke kaʻina pad e ʻae i nā vias e waiho i loko o ka ʻili o nā ʻāina pālahalaha. Hoʻopili ʻia ka via a hoʻopiha ʻia me kekahi epoxy conductive a i ʻole conductive a laila kāpili ʻia a uhi ʻia i luna, e ʻike maka ʻole ʻia ana.

Maʻalahi ke kani akā aia kahi awelika o ʻewalu mau hanana hou e hoʻopau ai i kēia kaʻina hana ʻokoʻa. E ukali pono nā pono hana kūikawā a me nā ʻenehana loea i ke kaʻina hana e hoʻokō i ka huna huna ʻia ma o.

Ma o nā ʻano hoʻopiha

Nui a hewahewa nā ʻano ʻokoʻa ma o ka hoʻopihapiha waiwai: non conductive epoxy, conductive epoxy, keleawe piha, piha ke kālā a me ka electrochemical plating. Hoʻopili kēia mau mea āpau ma o ke kanu ʻia ʻana ma waena o kahi ʻāina pālahalaha e kūʻai aku ai nā mea kūʻai aku e like me nā ʻāina maʻamau. Kuhi ʻia ʻo Vias a me nā microvias, makapō a kanu ʻia paha, hoʻopiha ʻia a uhi ʻia ma lalo o nā ʻāina SMT. ʻO ka hana ʻana i nā vias o kēia ʻano koi i nā pono hana kūikawā a me ka manawa nui. Hoʻohui ka wā o ke kaha drill a me ka ʻeli ʻana i ka hohonu i ke kaʻina manawa.

ʻOihana ʻenehana ʻo Laser Laser

ʻO ke kalai ʻana i ka mea liʻiliʻi o nā micro-vias e ʻae ai i ka ʻenehana hou aʻe ma ka papa o ka papa. Ke hoʻohana nei i kahi kukuna kukui 20 microns (1 Mil) i ke anawaena, hiki i kēia kaola ikaika kiʻekiʻe keʻoki i ka mea hao a me ke aniani e hana ana i ka mea liʻiliʻi ma o ka lua. Aia nā huahana hou e like me nā mea aniani kūlike i kahi laminate haʻahaʻa haʻahaʻa a me nā kūmau dielectric haʻahaʻa. ʻOi aku kēia mau mea i ke kūpaʻa wela kiʻekiʻe no ka hui manuahi kēpau a ʻae i nā lua liʻiliʻi e hoʻohana ʻia.

Lamination & Nā Pono Hana No Nā Papa HDI

Hāʻawi ka ʻenehana multilayer holomua i nā mea hoʻolālā e hoʻohui i ka pālua o nā papa e hana i PCB multilayer. ʻO ka hoʻohana ʻana o kahi drill laser e hana i nā lua i nā papa o loko e ʻae i ka plating, kiʻi a me ke kāwili ʻana ma mua o ke kaomi ʻana. ʻIke ʻia kēia hana i hoʻohui ʻia ma ke ʻano he kūkulu sequential. Hoʻohana ka hana ʻo SBU i nā vias i hoʻopiha piha ʻia e ʻae ana i ka hoʻokele pono ʻoi aku ka maikaʻi, kahi pilina ikaika a hoʻonui i ka hilinaʻi o ka papa.

Hoʻokumu kikoʻī ʻia ke keleawe lole pale kope e kōkua me ke ʻano maikaʻi o ka puka, ʻoi aku ka lōʻihi o ka manawa drill a ʻae i nā PCB lahilahi. He hōʻike haʻahaʻa a haʻahaʻa a haʻahaʻa a lahilahi hoʻi ka RCC i hoʻopaʻa ʻia me nā nodule minuscule i ka ʻili. Mālama ʻia kēia mea a primed no ka ʻenehana lahilahi a maikaʻi loa a me ka ʻenehana spacing.

Hoʻohana ka noi o ka pale maloʻo i ka laminate e hoʻohana i ka hana ʻōwili wela e hoʻopili i ka pale i nā mea nui. Kēia ʻenehana ʻenehana kahiko, ua paipai ʻia e preheat i nā mea i kahi mahana i makemake ʻia ma mua o ke kaʻina lamination no HDI pai papa kaapuni. ʻO ka preheating o nā mea e ʻae ai i kahi noi paʻa o ka maloʻo kūʻē i ka papa o ka laminate, e huki ana i ka wela mai nā ʻōwili wela a ʻae i nā mahana kū paʻa paʻa o ka huahana lamineka. ʻO ke komo ʻana o ka mahana me ka mahana wela e alakaʻi i ka hoʻopili ʻana o ka ea ma lalo o ke kiʻi ʻoniʻoni. He koʻikoʻi kēia i ka hana kope ʻana o nā laina maikaʻi a me ka spacing.