16 layer PCB Multi BGA no ke kelepona
Nāʻike huahana
Papa, | 16 mau papa |
Ka mānoanoa o ka papa | 2.0MM |
Mea Pono | Shengyi S1000-2 FR-4 (TG≥170 ℃) FR-4 |
Ka mānoanoa keleawe | 1 OZ (35um) |
ʻIli Pau | (ENIG) Gula immersion |
Min Hole (mm) | 0.20mm |
ʻO ka laulā laina laina (mm) | 0.11mm |
Mokuna laina min (mm) | 0.18mm |
Makakiʻi paukū | Ōmaʻomaʻo |
Waihona Legend | keʻokeʻo |
Impedance | Single Impedance & ʻokoʻa Impedance |
Hoʻopili | ʻEke anti kūpaʻa |
Hōʻikeʻike E. | ʻO ka ʻimi lele a i ʻole ke kau pono ʻana |
Hae ʻae ʻia | IPC-A-600H Papa 2 |
Palapala noi | Telecom |
Multilayer
I kēia ʻāpana, makemake mākou e hoʻolako iā ʻoe i nā kikoʻī e pili ana i nā koho kūkulu, nā ahonui, nā mea, a me nā kuhikuhi hoʻonohonoho no nā papa multilayer. E hoʻomaʻalahi kēia i kou ola ma ke ʻano he mea hoʻomohala a kōkua i ka hoʻolālā ʻana i kāu mau papa kaapuni i pai ʻia no ka hoʻonui ʻana no ka hana ʻana ma ke kumu kūʻai haʻahaʻa.
Nā kikoʻī laulā
Maʻamau | Kuikawa ** | |
Ka nui o ka huila kaapuni | 508mm X 610mm (20 ″ X 24 ″) | --- |
Ka helu o nā papa | i nā papa 28 | I noi |
Ka mānoanoa kaomi ʻia | 0.4 mm - 4.0mm | I noi |
Nā Pono PCB
Ma ke ʻano he mea hoʻolako i nā ʻenehana PCB like ʻole, nā puke, nā koho manawa alakaʻi, loaʻa iā mākou kahi koho o nā mea maʻamau i hiki ai ke uhi ʻia kahi bandwidth nui o nā ʻano o PCB a loaʻa mau i ka hale.
Hiki ke hoʻokō ʻia nā koi no nā mea ʻē aʻe a i ʻole no nā kumuhana kūikawā i ka nui o nā hihia, akā, kaukaʻi ʻia i nā koi kikoʻī, a hiki i kahi o 10 mau lā hana e pono ai e kiʻi i nā mea.
E launa pū me mākou a kūkākūkā i kāu mau makemake me kekahi o kā mākou kūʻai aku a i ʻole CAM hui.
Mālama ʻia nā mea maʻamau i nā waihona:
Nā ʻĀpana | Mānoanoa | Ke ahonui | ʻAno ulana |
Nā papa o loko | 0,05mm | +/- 10% | 106 |
Nā papa o loko | 0.10mm | +/- 10% | 2116 |
Nā papa o loko | 0,13mm | +/- 10% | 1504 |
Nā papa o loko | 0,15mm | +/- 10% | 1501 |
Nā papa o loko | 0.20mm | +/- 10% | 7628 |
Nā papa o loko | 0,25mm | +/- 10% | 2 x 1504 |
Nā papa o loko | 0.30mm | +/- 10% | 2 x 1501 |
Nā papa o loko | 0.36mm | +/- 10% | 2 x 7628 |
Nā papa o loko | 0,41mm | +/- 10% | 2 x 7628 |
Nā papa o loko | 0,51mm | +/- 10% | 3 x 7628/2116 |
Nā papa o loko | 0,61mm | +/- 10% | 3 x 7628 |
Nā papa o loko | 0.71mm | +/- 10% | 4 x 7628 |
Nā papa o loko | 0,80mm | +/- 10% | 4 x 7628/1080 |
Nā papa o loko | 1,0mm | +/- 10% | 5 x7628 / 2116 |
Nā papa o loko | 1,2mm | +/- 10% | 6 x7628 / 2116 |
Nā papa o loko | 1,55mm | +/- 10% | 8 x7628 |
Nā mea hoʻomākaukau | 0.058mm * | Pili i ka hoʻonohonoho | 106 |
Nā mea hoʻomākaukau | 0.084mm * | Pili i ka hoʻonohonoho | 1080 |
Nā mea hoʻomākaukau | 0.112mm * | Pili i ka hoʻonohonoho | 2116 |
Nā mea hoʻomākaukau | 0.205mm * | Pili i ka hoʻonohonoho | 7628 |
Ka mānoanoa Cu no nā papa o loko: Kūlana - 18µm a me 35 µm,
ma ke noi 70 µm, 105µm a me 140µm
Nā ʻano pono: FR4
Tg: approx. 150 ° C, 170 ° C, 180 ° C
atr ma 1 MHz: ≤5,4 (ʻano maʻamau: 4,7) Loaʻa hou aʻe ma ke noi
Ahu iho
ʻO ka PCB stack-up kahi mea nui i ka hoʻoholo ʻana i ka hana EMC o kahi huahana. Hiki ke maikaʻi loa kahi paʻa maikaʻi i ka hōʻemi ʻana i ka radiation mai nā puka lou ma ka PCB, a me nā kaula i hoʻopili ʻia i ka papa.
ʻEhā mau mea nui e pili ana i nā noʻonoʻo stack-up board:
1. Ka helu o nā papa,
2. Ka helu a me nā ʻano o nā mokulele (ka mana a me / a i ʻole ka pae) i hoʻohana ʻia,
3. ʻO ke kauoha a me ke kaʻina o nā papa, a
4. ʻO ka spacing ma waena o nā papa.
ʻAʻole hāʻawi ʻia ka noʻonoʻo nui inā koe ka helu o nā papa. I nā manawa he nui like nā mea ʻekolu ʻē aʻe. I ka hoʻoholo ʻana i ka helu o nā papa, e noʻonoʻo ʻia kēia mau mea:
1. Ka helu o nā hōʻailona e hoʻoneʻe ʻia a me ke kumukūʻai,
2. Frequency
3. E hoʻokō paha ka huahana i nā koi emission Class A a i ʻole Class B?
ʻO ka manawa pinepine ka mea mua wale nō e noʻonoʻo ʻia. I ka ʻoiaʻiʻo he mea koʻikoʻi nā mea āpau a pono e noʻonoʻo like ʻia. Inā loaʻa kahi hoʻolālā optimum i ka palena iki o ka manawa a me ke kumu kūʻai haʻahaʻa, hiki i ka mea hope loa ke lilo i mea nui a ʻaʻole pono e nānā ʻia.
ʻAʻole pono e kuhi ʻia ka paukū i luna e hiki ʻole ai iā ʻoe ke hana i kahi hoʻolālā EMC maikaʻi ma kahi papa ʻehā a ʻeono papa, no ka mea hiki iā ʻoe. Hōʻike wale ia ʻaʻole hiki ke hoʻokō ʻia nā pahuhopu āpau i ka manawa like a pono kekahi kuʻikahi. Ma muli o ka hiki ke hoʻokō ʻia nā pahuhopu EMC āpau a makemake ʻia me kahi papa ʻewalu papa, ʻaʻohe kumu o ka hoʻohana ʻana ma mua o ʻewalu mau papa ʻē aʻe ma mua o ka ʻae ʻana i nā papa hoʻokele hōʻailona hou aʻe
ʻO ka mānoanoa pooling pool no nā PCB multilayer he 1.55mm. Eia kekahi mau laʻana o ka PCB multilayer stack up.
Mīkini Kora PCB
ʻO kahi Papa Kālā Kī Kī KīWī (MCPCB), a i ʻole PCB pumehana, kahi ʻano o PCB i loaʻa kahi mea hao e like me ke kumu no ka ʻāpana pāhana wela o ka papa. ʻO ke kumu o ke kumu o ka MCPCB e hoʻohuli hou i ka wela mai nā mea papa koʻikoʻi a i nā wahi liʻiliʻi e like me ke kākoʻo heatsink metala a i ʻole ke kumu kila. Hoʻohana ʻia nā metala ma MCPCB ma ke ʻano he koho i nā papa FR4 a i ʻole CEM3.
Nā Mea Pono PCB Metal Core a me ka mānoanoa
Hiki i ke kinikini metala o ka PCB pumehana ke aluminika (aluminika core PCB), keleawe (PCB keleawe keleawe a i ʻole PCB keleawe kaumaha) a i ʻole ka huikau o nā ʻāpana kūikawā. ʻO ka mea maʻamau ka PCB kumu alumini.
ʻO ka mānoanoa o nā metala metala ma nā pā waihona PCB he 30 mil - 125 mil ka nui, akā hiki ke ʻoi aku ka lahilahi a me ka lahilahi o nā pā.
MCPCB keleawe pepa kini mānoanoa hiki i 1 - 10 oz.
Nā pōmaikaʻi o MCPCB
Hiki i nā MCPCB ke keu pono e hoʻohana no ko lākou hiki ke hoʻohui i kahi papa polymer dielectric me kahi conductivity wela kiʻekiʻe no kahi pale kūpanaha haʻahaʻa.
Hoʻololi nā PCB kumu nui i ka wela 8 a 9 mau manawa wikiwiki ma mua o FR4 PCB. MCPCB laminates hoʻopau i ka wela, mālama i ka hoʻomehana ʻana i nā ʻenehana i nā hopena i hoʻonui ʻia ka hana a me ke ola.